- Semiconductor Advanced PackagingJohn H. Lau
- Electronic packagingJohn H. Lau, C.P. Wong et al.
- Chiplet Design and Heterogeneous Integration PackagingJohn H. Lau
- Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assembliesJohn H. Lau
- Electronics manufacturingJohn H. Lau, C.P. Wong et al.
- Handbook of fine pitch surface mount technologyJohn H. Lau
- Solder Joint ReliabilityJohn H. Lau
- Flip chip technologiesJohn H. Lau
- Handbook of tape automated bondingJohn H. Lau
